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Epoxy EPO-TEK® H67MP-GB Epoxy Technology Inc.

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Datasheet

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Dissipation factor1kHz4.5E-03
Volume resistivity23°C2E+13ohms·cm
Relative permittivity1kHz5.01
LapShearStrength23°C>13.8MPa
Shore hardnessShoreD86
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
viscosity23°C330Pa·s
Curing time150°C1.0hr
storage stability40000min
density2.00g/cm³
ColorWhite
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:--21.7E-05cm/cm/°C
Glass transition temperature93.0°C
Linear coefficient of thermal expansionMD:导热系数0.43W/m/K
Linear coefficient of thermal expansionMD:--37.5E-05cm/cm/°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeNH4+44ppm
Ionic typeNa+<50ppm
Ionic typeK+<50ppm
Ionic typeCl-<200ppm
Particle size distribution<55.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating300°C1.6%
weight loss on heating250°C0.79%
weight loss on heating200°C0.29%
operate temperatureStorageModulus(23°C)5.88GPa
operate temperatureIntermittent-55-300°C
operate temperatureContinuous-55-200°C
DegradationTemperature360°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.