
PC/ABS HP-5004 NP LG YX NINGBO
16
Form:Granules | Grade:Injection grade
Properties:
High mobilityModerate heat resistanceLow temperature impact re
Typical Applications:
PhoneElectrical enclosure
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | Phone | Electrical enclosure |
| Properties: | High mobility | Moderate heat resistance | Low temperature impact re |
Certificates
No Data...
Technical Data Sheet
| mechanical properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| tensile strength | Yield | ASTM D638 | 55.3 | MPa |
| elongation | Break | ASTM D638 | 100 | % |
| Bending modulus | ASTM D790 | 2220 | MPa | |
| bending strength | ASTM D790 | 888 | MPa | |
| Impact strength of cantilever beam gap | 20℃ | ASTM D256 | 480 | J/m |
| -30℃ | ASTM D256 | 588 | J/m | |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Hot deformation temperature | 1.8 MPa,Unannealed | ASTM D648 | 115 | ℃ |
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| density | ASTM D792 | 1.14 | g/cm³ | |
| melt mass-flow rate | 250°C/2.16 kg | ASTM D955 | 5.1 | g/10min |
| Shrinkage rate | Flow | ASTM D785 | 0.5-08 | % |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.