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PC/ABS HP-5004 NP LG YX NINGBO

16

Form:Granules | Grade:Injection grade

Properties:
High mobilityModerate heat resistanceLow temperature impact re
Typical Applications:
PhoneElectrical enclosure
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Phone | Electrical enclosure
Properties:High mobility | Moderate heat resistance | Low temperature impact re

Certificates

No Data...

Technical Data Sheet

mechanical propertiesTest ConditionTest MethodTest ResultTest Unit
tensile strengthYieldASTM D63855.3MPa
elongationBreakASTM D638100%
Bending modulusASTM D7902220MPa
bending strengthASTM D790888MPa
Impact strength of cantilever beam gap20℃ASTM D256480J/m
Impact strength of cantilever beam gap-30℃ASTM D256588J/m
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Hot deformation temperature1.8 MPa,UnannealedASTM D648115
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
densityASTM D7921.14g/cm³
melt mass-flow rate250°C/2.16 kgASTM D9555.1g/10min
Shrinkage rateFlowASTM D7850.5-08%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.