PA66 A4H BASF GERMANY

128

Form：Granules | Grade：Injection grade

Properties:

Medium viscosityheat-resistingOil resistant

Typical Applications:

Laptop casewheel

Supplier(5)

Product Description

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Datasheet

Product Description

Typical Applications:	Laptop case \| wheel
Properties:	Medium viscosity \| heat-resisting \| Oil resistant

Certificates

Technical Data Sheet

impact performance	Test Condition	Test Method	Test Result	Test Unit
Impact strength of simply supported beam without notch	23℃	kJ/m²	11.143to19.964
mechanical properties	Test Condition	Test Method	Test Result	Test Unit
Charpy Notched Impact Strength	+23℃，干/湿字段1_文本		8/30	KJ/m
impact strength	-20℃,干		20	J
Elongation at Break	干/湿，V=50mm/min		4.2/20	%
Impact strength of cantilever beam gap	+23℃，干/湿		5.5/NB	KJ/m
Charpy Notched Impact Strength	+23℃，干/湿		NB/NB	KJ/m
Tensile modulus	干/湿		3100/1200	Mpa
impact strength	+23℃，干/湿		50/>140	J
Impact strength of cantilever beam gap	-30℃,干		7	KJ/m
Elongation at Break	干/湿，V=50mm/min		4.2/20	%
Tensile yield stress (V=50mm/min)	干/湿		85/50	Mpa
Ball Pressure Test	干/湿		160/100	Mpa
Tensile creep modulus	1000h,湿		700	Mpa
Fracture stress (V=50mm/min)	干/湿		85/50	Mpa
Bending modulus	干/湿		3000	Mpa
elongation	≤0.5%, +23℃，湿		700	Mpa
Elongation at Break		ASTM D638/ISO 527	4.2/20	%
Bending modulus		ASTM D790/ISO 178	3000	kg·cm/cm(J/M)ft·lb/in
elongation		ASTM D638/ISO 527	4.2/20	%
tensile strength	Break,23℃		144.83to292.41	MPa
Tensile modulus	23℃		8206.9to28000.0	MPa
Tensile strain	Break,23℃	%	1.9to3.1
thermal performance	Test Condition	Test Method	Test Result	Test Unit
Linear coefficient of thermal expansion		ASTM D696/ISO 11359	7-10	mm/mm.℃
Hot deformation temperature	HDT	ASTM D648/ISO 75	220	℃（℉）
Linear coefficient of thermal expansion	（23-80）℃，Dry		7-10
thermal conductivity	Dry		0.23	W/(m.K)
Hot deformation temperature	0.45MPa负荷，Dry		220	°C
Temperature index	在20000h/5000h，后拉伸强度下降50%时		118/138	°C
Hot deformation temperature	1.8MPa负荷，Dry		75	°C
specific heat	Dry		1.7	J/(g.K)
Maximum operating temperature			>200	°C
Continuous use temperature		°C	110to220
8.0Mpa, unannealed		°C	65to220
1.8MPa, unannealed		°C	230to250
transverse		mm/mm/°C	68.6E-5-127.0E-5
flow		mm/mm/°C	142.2E-5-203.2E-5
Melting temperature		°C	260
Physical properties	Test Condition	Test Method	Test Result	Test Unit
Saturation, 23 ℃		%	3.5to5.0
Balance, 23 ℃, 50% RH		%	1.2to1.5
Shrinkage rate	23℃	%	0.10-0.31
Electrical performance	Test Condition	Test Method	Test Result	Test Unit
Compared to the Leakage Traceability Index (CTI)	干/湿		CTI 575 M
Loss angle	1MHz，干/湿		0.025/0.2
Dielectric constant	1MHz，干/湿		3.2/5
Compared to the Leakage Traceability Index (CTI)	干/湿		CTI 600
Surface resistivity	干/湿		10	Ω
Dielectric strength	K20/P50，干/湿		110/80	KV/mm
Volume resistivity	干/湿		10	Ω.cm
Dielectric strength	23℃	V/mil	840
Volume resistivity	23℃	ohms·cm	1.0E+12-1.0E+14
hardness	Test Condition	Test Method	Test Result	Test Unit
Ball Pressure Test			222.76to370.34	MPa

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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