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Epoxy EPO-TEK® H31LV Epoxy Technology Inc.

Properties:
Filler silver
Typical Applications:
Adhesives electrical and electronic applications printed circuit boards light-emitting diodes
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesives | electrical and electronic applications | printed circuit boards | light-emitting diodes
Properties:Filler | silver

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD85
Volume resistivity23°C<8.0E-3ohms·cm
LapShearStrength23°C9.65MPa
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
ColorSilver
storage stability4300min
Curing time150°C1.0hr
viscosity23°C2.0to3.5Pa·s
density1.57g/cm³
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life26wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:导热系数0.55W/m/K
Linear coefficient of thermal expansionMD:--41.5E-04cm/cm/°C
Linear coefficient of thermal expansionMD:--32.6E-05cm/cm/°C
Glass transition temperature>110°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<45.0µm
Ionic typeNH4+8ppm
Ionic typeNa+380ppm
Ionic typeK+47ppm
Ionic typeCl-14ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating300°C1.1%
weight loss on heating250°C0.27%
weight loss on heating200°C0.13%
operate temperatureThixotropicIndex1.80
operate temperatureStorageModulus(23°C)1.77GPa
operate temperatureIntermittent-55-300°C
operate temperatureContinuous-55-200°C
Shear Strength23°C11.7MPa
DegradationTemperatureTGA387°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.