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Epoxy EPO-TEK® H70E-2LC Epoxy Technology Inc.

Typical Applications:
Electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Electrical and electronic applications | adhesives

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD72
Dissipation factor1kHz6.6E-03
Relative permittivity1kHz5.05
Volume resistivity23°C>1.5E+13ohms·cm
LapShearStrength23°C13.6MPa
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
densityPot Life3600min
density固化时间(150°C)1.0hr
density粘度7(23°C)6.5to9.5Pa·s
densityPartB2.30g/cm³
densityPartA1.63g/cm³
Color--6Cream
Color--5Black
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsShelf Life(23°C)52wk
Thermosetting componentsPartB按重量计算的混合比:1.0
Thermosetting componentsPartA按重量计算的混合比:1.0
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:导热系数0.79W/m/K
Linear coefficient of thermal expansionMD:--31.8E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--47.5E-05cm/cm/°C
Glass transition temperature>60.0°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic type Cl194ppm
Particle size distribution<50.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
operate temperatureThixotropicIndex3.26
DegradationTemperature400°C
operate temperatureWeightLossonHeating(250°C)0.67%
operate temperatureStorageModulus(23°C)6.37GPa
operate temperatureIntermittent-55-350°C
operate temperatureContinuous-55-175°C
Shear Strength23°C23.4MPa
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.