PA6 B3WG10 BASF GERMANY

Form：Granules | Grade：Injection grade

Properties:

Thermal stabilityHigh mobilityHigh rigidityHeat aging

Typical Applications:

Industrial components

Supplier(1)

Product Description

Certificates(1)

Datasheet

Product Description

Typical Applications:	Industrial components
Properties:	Thermal stability \| High mobility \| High rigidity \| Heat aging

Certificates

Technical Data Sheet

other	Test Condition	Test Method	Test Result	Test Unit
characteristic			高刚性良好的耐热老化性能
purpose			工业领域
mechanical properties	Test Condition	Test Method	Test Result	Test Unit
Tensile creep modulus	1000h，湿		7400	Mpa
Elongation at Break	干/湿，V=50mm/min		3/5.5	%
Tensile modulus	干/湿		16000/11000	Mpa
Tensile yield stress (V=50mm/min)	干/湿		235/160	Mpa
Elongation at Break	干/湿，V=50mm/min		3/5.5	%
Charpy Notched Impact Strength	+23℃，干/湿		100/110	KJ/m
	Charpy Notched Impact Strength	干/湿		22/30	KJ/m
	Charpy Notched Impact Strength	Charpy Notched Impact Strength	30℃，干		90	KJ/m
Bending modulus	干/湿		15000/9000	Mpa
impact strength	+23℃，干/湿		3/10	J
Charpy Notched Impact Strength	30℃，干/湿		16	KJ/m
Fracture stress (V=50mm/min)	干/湿		235/160	Mpa
bending strength	干/湿		320/240	Mpa
elongation	≤0.5%, +23℃，湿		7400	Mpa
Impact strength of cantilever beam gap	+23℃，干/湿		20/24	KJ/m
Ball Pressure Test	干/湿		280/210	Mpa
thermal performance	Test Condition	Test Method	Test Result	Test Unit
specific heat	Dry		1.3	J/(g.K)
Hot deformation temperature	0.45MPa负荷,Dry		220	°C
thermal conductivity	Dry		0.32	W/(m.K)
Temperature index	在20000h/5000h，后拉伸强度下降50%时		130/160	°C
Maximum operating temperature			200	°C
Hot deformation temperature	1.8MPa负荷，Dry		215	°C
Linear coefficient of thermal expansion	（23-80）℃，Dry		1-1.5/5-6
Physical properties	Test Condition	Test Method	Test Result	Test Unit
density		ASTM D792/ISO 1183	1.55
Shrinkage rate		ASTM D955	0.3	%
Electrical performance	Test Condition	Test Method	Test Result	Test Unit
Loss angle	1MHz，干/湿		0.014/0.14
Dielectric constant	1MHz，干/湿		4.2/6.1
Dielectric strength	K20/P50，干/湿		90/40	KV/mm
Volume resistivity	干/湿		10	Ω.cm
Surface resistivity	干/湿		10	Ω
Compared to the Leakage Traceability Index (CTI)	干/湿		CTI 450

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

Get App

Top