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PFA AP-231SH DAIKIN JAPAN
199
Form：Granules | Grade：Injection grade
Properties:
Weather resistanceFlame retardantHigh temperature resistan
Typical Applications:
Semiconductor molding compounds
Product Description
Certificates(1)
Datasheet
Product Description
| Typical Applications: | Semiconductor molding compounds |
| Properties: | Weather resistance | Flame retardant | High temperature resistan |
Certificates
Technical Data Sheet
| mechanical properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| tensile strength | ASTM D3307 | > 30.0 | Mpa | |
| elongation | Break | ASTM D3307 | > 300 | % |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Melting temperature | ASTM D3307 | 300 to 310 | °C | |
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| melt mass-flow rate | 372°C/5.0 kg | ASTM D3307 | 1.5 to 2.5 | g/10 min |
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