
LCP E6808LHF-BZ-Z SUMITOMO JAPAN
241
Form:Granules | Grade:Injection grade
Properties:
Low warpageGood forming performanceGlass fiber reinforcedenhanceFiller: Long glass fiber40%Filler by weight
Typical Applications:
Automotive sectorLaptop caseSpool
Product Description
Certificates(1)
Datasheet
Product Description
| Typical Applications: | Automotive sector | Laptop case | Spool |
| Properties: | Low warpage | Good forming performance | Glass fiber reinforced | enhance | Filler: Long glass fiber | 40% | Filler by weight |
Certificates

Technical Data Sheet
| impact performance | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Suspended wall beam without notch impact strength | 6.40mm | ASTM D256 | 270 | J/m |
| flammability | Test Condition | Test Method | Test Result | Test Unit |
| Extreme Oxygen Index | ISO 489 | 44 | % | |
| UL flame retardant rating | 0.30mm | UL 94 | V-0 | |
| mechanical properties | Test Condition | Test Method | Test Result | Test Unit |
| shear strength | ASTM D732 | 54.0 | Mpa | |
| bending strength | Yield,23°C | ASTM D790 | 140 | Mpa |
| Bending modulus | 23°C | ASTM D790 | 12500 | Mpa |
| elongation | Break | ASTM D638 | 4.5 | % |
| tensile strength | Yield | ASTM D638 | 130 | Mpa |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Linear coefficient of thermal expansion | MD:150°C | Internal Method | 4E-06 | cm/cm/°C |
| TD:150°C | Internal Method | 8.1E-05 | cm/cm/°C | |
| Hot deformation temperature | 1.8MPa,Unannealed | ASTM D648 | 270 | °C |
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Water absorption rate | Saturation | ASTM D570 | 0.020 | % |
| Shrinkage rate | TD | Internal Method | 0.40 | % |
| MD | Internal Method | 0.17 | % | |
| Electrical performance | Test Condition | Test Method | Test Result | Test Unit |
| Dielectric constant | 1MHz | ASTM D150 | 3.80 | |
| Compared to the anti leakage trace index | IEC 60112 | PLC 3 | ||
| Arc resistance | ASTM D495 | 140 | sec | |
| Dissipation factor | 1.00GHz | ASTM D150 | 4E-03 | |
| 1MHz | ASTM D150 | 0.038 | ||
| Dielectric constant | 1.00GHz | ASTM D150 | 3.60 | |
| Volume resistivity | ASTM D257 | 1E+15 | ohms·cm | |
| hardness | Test Condition | Test Method | Test Result | Test Unit |
| Rockwell hardness | R-Scale | ASTM D785 | 97 | |
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| Solder resistance | Internal Method | 280 | °C |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.