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PFA AP-211SH DAIKIN JAPAN
216
Form：Granules | Grade：Injection grade
Properties:
Weather resistanceFlame retardant
Typical Applications:
Semiconductor molding compoundsSemiconductor molding compounds
Product Description
Certificates(1)
Datasheet
Product Description
| Typical Applications: | Semiconductor molding compounds | Semiconductor molding compounds |
| Properties: | Weather resistance | Flame retardant |
Certificates
Technical Data Sheet
| Filling analysis | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Melt viscosity | 380℃ | No Standard | 2.00E+6 - 2.50E+7 | mPa·s |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Linear coefficient of thermal expansion | 20 to 100℃ | ASTM D696 | 0.00012 | cm/cm/℃ |
| Melting temperature | ASTM D-1523 | 300 to 310 | °C | |
| Extreme Oxygen Index | 1.57 mm | ASTM D2863 | > 95 | % |
| UL flame retardant rating | 1.57 mm | UL 94 | V-0 | |
| thermal conductivity | ASTM C177 | 0.26 | W/m/K | |
| specific heat | No Standard | 1050 | J/kg/℃ | |
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Water absorption rate | Saturation | ASTM D570 | < 0.010 | % |
| melt mass-flow rate | 372℃/5.0 kg | ASTM D1238 | 10 to 18 | g/10 min |
| Apparent density | JIS K6891 | 1.00 to 1.40 | g/cm³ |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.