PFA NEOFLON®  AP-211SH DAIKIN JAPAN

463
  • Properties:
    Weather resistance
    Flame retardant
  • Usages:
    Semiconductor molding compounds
    Semiconductor molding compounds
  • Certificates:
    UL

Technical Data Sheet

physical property Test ConditionTest MethodTest Result
Apparent densityJIS K68911.00 to 1.40 g/cm³
melt mass-flow rateASTM D123810 to 18 g/10 min
Water absorption rateASTM D570< 0.010 %
Filling analysisTest ConditionTest MethodTest Result
melt viscosityNo Standard2.00E+6 - 2.50E+7 mPa·s
Thermal performanceTest ConditionTest MethodTest Result
melting temperatureASTM D-1523300 to 310 °C
Linear coefficient of thermal expansionASTM D6960.00012 cm/cm/℃
specific heatNo Standard1050 J/kg/℃
thermal conductivityASTM C1770.26 W/m/K
UL flame retardant ratingUL 94V-0
Limiting Oxygen IndexASTM D2863> 95 %
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

Contact Us

Get App

Top