
Epoxy E4110-LV Epoxy Technology Inc.
Properties:
Filler silver
Typical Applications:
Printed circuit boards light-emitting diodes adhesives optical applications electrical and electronic applications
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | Printed circuit boards | light-emitting diodes | adhesives | optical applications | electrical and electronic applications |
| Properties: | Filler | silver |
Certificates
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Technical Data Sheet
| Cured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Volume resistivity | 23°C8 | <9.0E-3 | ohms·cm | |
| 23°C | <5.0E-4 | ohms·cm | ||
| LapShearStrength | 23°C | 7.45 | MPa | |
| Shore hardness | ShoreD | 60 | ||
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
| density | Pot Life | 360 | min | |
| 固化时间(150°C) | 1.0 | hr | ||
| 粘度7(23°C) | 0.35to0.85 | Pa·s | ||
| PartA | 3.09 | g/cm³ | ||
| PartB | 0.958 | g/cm³ | ||
| Color | --6 | Silver | ||
| --5 | Clear/Transparent | |||
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| Thermosetting components | Shelf Life(23°C) | 52 | wk | |
| PartB | 按重量计算的混合比:1.0 | |||
| PartA | 按重量计算的混合比:10 | |||
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Linear coefficient of thermal expansion | MD:--3 | 5E-05 | cm/cm/°C | |
| Glass transition temperature | >40.0 | °C | ||
| Linear coefficient of thermal expansion | MD:导热系数 | 1.8 | W/m/K | |
| MD:--4 | 2.8E-04 | cm/cm/°C | ||
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Ionic type | NH4+ | 27 | ppm | |
| Na+ | 0 | ppm | ||
| K+ | 0 | ppm | ||
| Cl- | 332 | ppm | ||
| Particle size distribution | <45.0 | µm | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| DegradationTemperature | 365 | °C | ||
| weight loss on heating | 300°C | 1.2 | % | |
| Shear Strength | 23°C | 11.7 | MPa | |
| operate temperature | 间歇 | <250 | °C | |
| StorageModulus | 5.44 | GPa | ||
| THIXOTROPIC INDEX | 1.90 | |||
| weight loss on heating | 200°C | 0.33 | % | |
| 250°C | 0.65 | % |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.