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Epoxy H70E-1 Epoxy Technology Inc.

Typical Applications:
Electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Electrical and electronic applications | adhesives

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD88
LapShearStrength23°C12.5MPa
Relative permittivity1kHz4.47
Volume resistivity23°C>1.5E+13ohms·cm
Dissipation factor1kHz8.7E-03
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
densityPot Life2900min
Color--5Grey
Color--6Grey.Light
densityPartA1.63g/cm³
densityPartB2.37g/cm³
density粘度7(23°C)24to34Pa·s
density固化时间(150°C)1.0hr
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsPartA按重量计算的混合比:1.0
Thermosetting componentsPartB按重量计算的混合比:1.0
Thermosetting componentsShelf Life(23°C)26wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:--32.1E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--41.1E-04cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数0.71W/m/K
Glass transition temperature>80.0°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<50.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating300°C1.2%
DegradationTemperature450°C
Shear Strength23°C11.7MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)6.67GPa
operate temperatureThixotropicIndex4.92
weight loss on heating200°C0.060%
weight loss on heating250°C0.34%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.