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PI, TS EPO-TEK® P1011 Epoxy Technology Inc.

Properties:
Filler silver
Typical Applications:
Adhesive electrical and electronic application fields
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesive | electrical | and electronic application fields
Properties:Filler | silver

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Volume resistivity23°C<5.0E-4ohms·cm
Shore hardnessShoreD61
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Curing time150°C1.0hr
Curing time80°C6<0.50hr
ColorSilver
viscosity23°C8.0to12Pa·s
density2.38g/cm³
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life23°C52wk
drying time7.0day
Post curing time285°C1.5hr
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:导热系数>2.7W/m/K
Linear coefficient of thermal expansionMD:--42.3E-04cm/cm/°C
Linear coefficient of thermal expansionMD:--33.2E-05cm/cm/°C
Glass transition temperature>100°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeNH4+27ppm
Ionic typeNa+39ppm
Ionic typeK+18ppm
Ionic typeCl-114ppm
Particle size distribution<20.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating300°C0.15%
weight loss on heating250°C0.080%
operate temperatureIntermittent-55-325°C
operate temperatureContinuous-55-225°C
Shear Strength23°C11.7MPa
DegradationTemperatureTGA389°C
operate temperatureThixotropicIndex1.90
weight loss on heating200°C0.060%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.