FEP TEFLON® 5100-J
761
- Properties:Thermal stabilityHigh temperature resistanHigh mobilityExcellent toughness/compoHeavy packaging bags
- Usages:Electronic and electrical componentsAutomotive components
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View PricesTechnical Data Sheet
| physical property | Test Condition | Test Method | Test Result |
|---|---|---|---|
| melt mass-flow rate | ASTM D1238 | 0.85 g/10min | |
| film thickness | 25 μm |
| other | Test Condition | Test Method | Test Result |
|---|---|---|---|
| Additive content | 无 |
| Mechanical properties | Test Condition | Test Method | Test Result |
|---|---|---|---|
| Dart impact | ASTM D1709 | 540A g | |
| Elmendorf tear strength | ASTM D1922 | 260/670 g | |
| tensile strength | ASTM D882 | 11.9/12.4 Mpa | |
| ASTM D882 | 43.6/36.0 Mpa | ||
| elongation at break | ASTM D882 | 480/620 % | |
| Secant modulus | ASTM D882 | 231/256 Mpa | |
| puncture resistance | 陶氏方法 | 28.3 J/cm³ |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.
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