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Epoxy EPO-TEK® H35-175MPT Epoxy Technology Inc.

Properties:
Filler silver
Typical Applications:
Adhesives military applications electrical and electronic applications
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesives | military applications | electrical and electronic applications
Properties:Filler | silver

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD83
LapShearStrength23°C11.7MPa
Volume resistivity23°C<5.0E-4ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
density3.64g/cm³
viscosity23°C90to110Pa·s
Curing time180°C1.0hr
storage stability40000min
ColorSilver
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>100°C
Linear coefficient of thermal expansionMD:--33.5E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--41.2E-04cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数2.7W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<20.0µm
Ionic typeCl-<200ppm
Ionic typeK+<50ppm
Ionic typeNa+<50ppm
Ionic typeNH4+32ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
DegradationTemperatureTGA354°C
Shear Strength23°C23.4MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)2.92GPa
operate temperatureThixotropicIndex4.60
weight loss on heating200°C0.030%
weight loss on heating250°C0.050%
weight loss on heating300°C0.13%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.