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Epoxy EPO-TEK® H20E-MP Epoxy Technology Inc.

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Datasheet

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD75
LapShearStrength23°C10.2MPa
Volume resistivity23°C<4.0E-4ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
densityPot Life2900min
densityPartA2.02g/cm³
densityPartB3.06g/cm³
density粘度9(23°C)2.2to3.2Pa·s
density固化时间(150°C)1.0hr
Color--7Silver
Color--8Silver
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsPartA按重量计算的混合比:1.0
Thermosetting componentsPartB按重量计算的混合比:1.0
Thermosetting componentsShelf Life(23°C)26wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
thermal conductivity--52.5W/m/K
thermal conductivity--629W/m/K
Glass transition temperature>80.0°C
Linear coefficient of thermal expansionMD:--33.1E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--41.6E-04cm/cm/°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeNa+<50ppm
Ionic typeNH4+126ppm
Particle size distribution<45.0µm
Ionic typeCl-<200ppm
Ionic typeK+<50ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
operate temperatureStorageModulus(23°C)5.58GPa
operate temperatureThixotropicIndex4.63
weight loss on heating200°C0.59%
operate temperatureIntermittent-55-300°C
weight loss on heating250°C1.1%
weight loss on heating300°C1.7%
DegradationTemperatureTGA425°C
Shear Strength23°C23.4MPa
operate temperatureContinuous-55-200°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.