Share
Add to compare

Epoxy E3001-HV Epoxy Technology Inc.

Properties:
Filler silver
Typical Applications:
Electrical and electronic applications adhesives light-emitting diodes printed circuit boards
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Electrical and electronic applications | adhesives | light-emitting diodes | printed circuit boards
Properties:Filler | silver

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD80
LapShearStrength23°C10.3MPa
Volume resistivity23°C<5.0E-4ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
ColorSilver
density2.83g/cm³
viscosity23°C11to14Pa·s
Curing time150°C1.0hr
storage stability1400min
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>100°C
Linear coefficient of thermal expansionMD:--32.4E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--47.7E-05cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数1.1W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<20.0µm
Ionic typeCl-125ppm
Ionic typeK+4ppm
Ionic typeNa+6ppm
Ionic typeNH4+27ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
Shear Strength23°C23.4MPa
operate temperatureContinuous-55-200°C
DegradationTemperatureTGA435°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)2.15GPa
operate temperatureThixotropicIndex3.90
operate temperatureWeightLossonHeating(300°C)0.23%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.