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Epoxy EPO-TEK® TD1001 Epoxy Technology Inc.
Typical Applications:
Adhesive Electrical Electronic Application Fields Adhesive
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | Adhesive | Electrical | Electronic Application Fields | Adhesive |
Certificates
No Data...
Technical Data Sheet
| Cured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Volume resistivity | 23°C | >2.0E+13 | ohms·cm | |
| Dissipation factor | 1kHz | 0.010 | ||
| Relative permittivity | 1kHz | 3.12 | ||
| LapShearStrength | 23°C | >13.8 | MPa | |
| Shore hardness | ShoreD | 85 | ||
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
| Curing time | 125°C | >1.0 | hr | |
| viscosity | 23°C | 10to22 | Pa·s | |
| density | 1.20 | g/cm³ | ||
| Color | White | |||
| storage stability | 40000 | min | ||
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| shelf-life | -40°C | 52 | wk | |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Linear coefficient of thermal expansion | MD：导热系数 | 0.77 | W/m/K | |
| MD：--3 | 2.1E-04 | cm/cm/°C | ||
| MD：--2 | 5.7E-05 | cm/cm/°C | ||
| Glass transition temperature | >40.0 | °C | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| weight loss on heating | 300°C | 0.44 | % | |
| 250°C | 0.14 | % | ||
| operate temperature | ThixotropicIndex | 4.10 | ||
| StorageModulus(23°C) | 1.98 | GPa | ||
| Intermittent | -55-325 | °C | ||
| Continuous | -55-225 | °C | ||
| Shear Strength | 23°C | 35.2 | MPa | |
| DegradationTemperature | TGA | 436 | °C |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.