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Epoxy EPO-TEK® H20E-SLR-HVMX Epoxy Technology Inc.

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Datasheet

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Volume resistivity23°C<4.0E-3ohms·cm
LapShearStrength23°C12.7MPa
Shore hardnessShoreD55
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
densityPot Life1100min
density固化时间(140°C)0.17hr
density粘度7(23°C)7.2Pa·s
densityPartA2.60g/cm³
Color--6Silver
Color--5Amber
densityPartB1.10g/cm³
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsShelf Life(23°C)52wk
Thermosetting componentsPartB按重量计算的混合比:11
Thermosetting components按重量计算的混合比100
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:导热系数1.5W/m/K
Linear coefficient of thermal expansionMD:--42.6E-04cm/cm/°C
Linear coefficient of thermal expansionMD:--35.1E-05cm/cm/°C
Glass transition temperature88.0°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<20.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
Shear Strength23°C23.4MPa
DegradationTemperature400°C
weight loss on heating300°C2.4%
weight loss on heating250°C1.3%
weight loss on heating200°C0.36%
operate temperatureThixotropicIndex3.51
operate temperatureStorageModulus6.11GPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.