Share
Add to compare

Epoxy T6065 Epoxy Technology Inc.

Typical Applications:
Adhesive bonding agent electrical and electronic application fields
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesive | bonding agent | electrical and electronic application fields

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD92
LapShearStrength23°C>13.8MPa
Relative permittivity1kHz5.30
Volume resistivity23°C>1.2E+14ohms·cm
Dissipation factor1kHz0.011
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
storage stability40000min
ColorWhite
density1.68g/cm³
viscosity23°C80to120Pa·s
Curing time180°C>1.0hr
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>100°C
Linear coefficient of thermal expansionMD:--23.8E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--31.4E-04cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数0.79W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeCl-135ppm
Ionic typeK+6ppm
Ionic typeNa+48ppm
Ionic typeNH4+105ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
Shear Strength23°C46.9MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)5.63GPa
operate temperatureThixotropicIndex1.88
weight loss on heating200°C0.10%
weight loss on heating250°C0.16%
weight loss on heating300°C0.30%
DegradationTemperature397°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.