Epoxy T6065

0
  • Usages:
    Adhesives
    adhesives
    electrical
    electronic applications

Technical Data Sheet

Uncured PropertiesTest ConditionTest MethodTest Result
STORAGE STABILITY40000 min
colourWhite
density1.68 g/cm³
80到120 Pa·s
Curing Time>1.0 hr
Cured PropertiesTest ConditionTest MethodTest Result
Supporting hardness92
LapShearStrength>13.8 MPa
5.30
Volume resistivity>1.2E+14 ohms·cm
Dissipation Factor0.011
physical property Test ConditionTest MethodTest Result
Ionic type135 ppm
Ionic type6 ppm
Ionic type48 ppm
Ionic type105 ppm
thermosettingTest ConditionTest MethodTest Result
shelf-life52 wk
Supplementary InformationTest ConditionTest MethodTest Result
Shear Strength46.9 MPa
Operating-55到200 °C
Operating-55到300 °C
Operating5.63 GPa
Operating1.88
WeightLossonHeating0.10 %
WeightLossonHeating0.16 %
WeightLossonHeating0.30 %
DegradationTemperature397 °C
Thermal performanceTest ConditionTest MethodTest Result
Glass Transition Temperature>100 °C
3.8E-05 cm/cm/°C
1.4E-04 cm/cm/°C
Linear coefficient of thermal expansion0.79 W/m/K
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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