Epoxy EPO-TEK® H21D

0
  • Properties:
    Filler
    silver
  • Usages:
    Electrical and electronic applications
    adhesives
    aerospace applications
    adhesives

Technical Data Sheet

Uncured PropertiesTest ConditionTest MethodTest Result
ColorSilver
ColorSilver
density2.13 g/cm³
density2.44 g/cm³
density14to20 Pa·s
density1.0 hr
densityPot Life900 min
physical property Test ConditionTest MethodTest Result
Particle size<45.0 µm
Ionic type64 ppm
Ionic type72 ppm
Ionic type121 ppm
thermosettingTest ConditionTest MethodTest Result
Thermosetting components按重量计算的混合比:10
Thermosetting components按重量计算的混合比:1.0
Thermosetting components52 wk
Cured PropertiesTest ConditionTest MethodTest Result
Shore hardness60
LapShearStrength10.4 MPa
Volume resistivity<9.0E-4 ohms·cm
Supplementary InformationTest ConditionTest MethodTest Result
weight loss on heating0.060 %
weight loss on heating0.17 %
operate temperature5.53 GPa
operate temperature2.60
weight loss on heating0.030 %
DegradationTemperature416 °C
Shear Strength23.4 MPa
operate temperature-55-250 °C
operate temperature-55-350 °C
Thermal performanceTest ConditionTest MethodTest Result
Glass Transition Temperature>100 °C
Linear coefficient of thermal expansion2.3E-04 cm/cm/°C
Linear coefficient of thermal expansion1.0 W/m/K
Linear coefficient of thermal expansion4.2E-05 cm/cm/°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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