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Epoxy H74 Epoxy Technology Inc.

Typical Applications:
Adhesives electrical and electronic applications seals
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesives | electrical and electronic applications | seals

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Dissipation factor1kHz7E-03
LapShearStrength23°C11.4MPa
Shore hardnessShoreD90
Relative permittivity1kHz4.95
Volume resistivity>4.0E+12ohms·cm
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Color--5Amber
Color--6Grey
densityPartB1.02g/cm³
densityPartA2.10g/cm³
density粘度7(23°C)45to65Pa·s
density固化时间(150°C)1.0hr
densityPot Life120min
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting components按重量计算的混合比100
Thermosetting componentsPartB按重量计算的混合比:3.0
Thermosetting componentsShelf Life(23°C)52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>100°C
Linear coefficient of thermal expansionMD:--32.1E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--49.5E-05cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数1.3W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<50.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
weight loss on heating200°C0.29%
weight loss on heating250°C0.50%
weight loss on heating300°C0.80%
DegradationTemperatureTGA425°C
Shear Strength23°C35.2MPa
operate temperatureContinuous-55-250°C
operate temperatureIntermittent-55-350°C
operate temperatureStorageModulus(23°C)5.93GPa
operate temperatureThixotropicIndex2.14
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.