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Epoxy H70E Epoxy Technology Inc.

Typical Applications:
Adhesive bonding agent electrical and electronic application fields
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Adhesive | bonding agent | electrical and electronic application fields

Certificates

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD83
LapShearStrength23°C>13.8MPa
Relative permittivity1kHz4.22
Volume resistivity>1.0E+13ohms·cm
Dissipation factor1kHz4E-03
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Color--6Grey
densityPartA1.50g/cm³
densityPartB2.49g/cm³
density粘度7(23°C)4.0to7.0Pa·s
density固化时间(150°C)1.0hr
densityPot Life3400min
Color--5Beige
thermosettingTest ConditionTest MethodTest ResultTest Unit
Thermosetting componentsPartA按重量计算的混合比:1.0
Thermosetting componentsPartB按重量计算的混合比:1.0
Thermosetting componentsShelf Life(23°C)52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>80.0°C
Linear coefficient of thermal expansionMD:--31.5E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--46.4E-05cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数0.90W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic type Cl186ppm
Particle size distribution<50.0µm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
DegradationTemperatureTGA451°C
Shear Strength23°C23.4MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)5.43GPa
operate temperatureThixotropicIndex1.17
weight loss on heating200°C0.24%
weight loss on heating250°C0.75%
weight loss on heating300°C1.6%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.