Epoxy 930

0
  • Usages:
    Electrical and electronic application fields
    printed circuit boards

Technical Data Sheet

Uncured PropertiesTest ConditionTest MethodTest Result
densityPot Life360 min
colourAmber
colourWhite
density1.02 g/cm³
density1.66 g/cm³
density>820 Pa·s
density1.0 hr
Cured PropertiesTest ConditionTest MethodTest Result
Supporting hardness82
LapShearStrength4.54 MPa
3.96
Volume resistivity>2.0E+13 ohms·cm
Dissipation Factor6E-03
physical property Test ConditionTest MethodTest Result
Particle size<500 µm
thermosettingTest ConditionTest MethodTest Result
按重量计算的混合比:100
按重量计算的混合比:3.3
52 wk
Supplementary InformationTest ConditionTest MethodTest Result
Operating-55到250 °C
Operating9.06 GPa
Operating0.86 %
DegradationTemperature350 °C
Shear Strength11.7 MPa
Operating-55到150 °C
Thermal performanceTest ConditionTest MethodTest Result
Glass Transition Temperature>90.0 °C
1.6E-05 cm/cm/°C
8.1E-05 cm/cm/°C
Linear coefficient of thermal expansion4.6 W/m/K
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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