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Epoxy 930 Epoxy Technology Inc.
Typical Applications:
Electrical and electronic applications printed circuit boards
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | Electrical and electronic applications | printed circuit boards |
Certificates
No Data...
Technical Data Sheet
| Cured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Shore hardness | ShoreD | 82 | ||
| LapShearStrength | 23°C | 4.54 | MPa | |
| Relative permittivity | 1kHz | 3.96 | ||
| Volume resistivity | 23°C | >2.0E+13 | ohms·cm | |
| Dissipation factor | 1kHz | 6E-03 | ||
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
| density | Pot Life | 360 | min | |
| Color | --5 | Amber | ||
| --6 | White | |||
| density | PartB | 1.02 | g/cm³ | |
| PartA | 1.66 | g/cm³ | ||
| 粘度(23°C) | >820 | Pa·s | ||
| 固化时间(150°C) | 1.0 | hr | ||
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| Thermosetting components | 按重量计算的混合比 | 100 | ||
| PartB | 按重量计算的混合比:3.3 | |||
| Shelf Life(23°C) | 52 | wk | ||
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Glass transition temperature | >90.0 | °C | ||
| Linear coefficient of thermal expansion | MD：--3 | 1.6E-05 | cm/cm/°C | |
| MD：--4 | 8.1E-05 | cm/cm/°C | ||
| MD：导热系数 | 4.6 | W/m/K | ||
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Particle size distribution | <500 | µm | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| operate temperature | Intermittent | -55-250 | °C | |
| StorageModulus(23°C) | 9.06 | GPa | ||
| WeightLossonHeating(300°C) | 0.86 | % | ||
| DegradationTemperature | 350 | °C | ||
| Shear Strength | 23°C | 11.7 | MPa | |
| operate temperature | Continuous | -55-150 | °C |
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