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Epoxy T6067 Epoxy Technology Inc.

Product Description
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Datasheet

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
LapShearStrength23°C10.5MPa
Relative permittivity1kHz4.90
Shore hardnessShoreD84
Volume resistivity23°C>6.0E+9ohms·cm
Dissipation factor1kHz4.1E-03
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
ColorWhite
density2.00g/cm³
viscosity23°C300to400Pa·s
Curing time150°C>1.0hr
storage stability40000min
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Linear coefficient of thermal expansionMD:导热系数0.45W/m/K
Glass transition temperature>90.0°C
Linear coefficient of thermal expansionMD:--31.6E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--46.8E-05cm/cm/°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<20.0µm
Ionic typeCl-177ppm
Ionic typeK+13ppm
Ionic typeNa+24ppm
Ionic typeNH4+87ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
DegradationTemperature350°C
Shear Strength23°C23.4MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)4.43GPa
weight loss on heating200°C0.48%
weight loss on heating250°C0.71%
weight loss on heating300°C1.2%
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.