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Epoxy UJ1190 Epoxy Technology Inc.

Typical Applications:
adhesive
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:adhesive

Certificates

No Data...

Technical Data Sheet

Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Curing time150°C50.012hr
Curing time150°C0.025to0.050hr
impact performanceTest ConditionTest MethodTest ResultTest Unit
Impact strength of cantilever beam gap32J/m
mechanical propertiesTest ConditionTest MethodTest ResultTest Unit
compressive strength241MPa
bending strength138MPa
tensile strength96.5MPa
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life35°C0.29wk
shelf-life25°C1.0wk
shelf-life5°C52wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
MaximumOperatingTemperature-Intermittent200°C
thermal conductivity0.84W/m/K
Hot deformation temperature1.8MPa,Unannealed110°C
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Shrinkage rateMD0.50%
Spiral flow length69.0cm
Apparent density1.00g/cm³
density1.91g/cm³
Electrical performanceTest ConditionTest MethodTest ResultTest Unit
Dielectric strength3.18mm14kV/mm
Volume resistivity1E+16ohms·cm
Surface resistivity1E+16ohms
Arc resistance200sec
Dissipation factor1kHz4E-03
Dielectric constant1kHz3.80
hardnessTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD85
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
Dissipation factor0.0150
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.