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Epoxy EPO-TEK® H61ND Epoxy Technology Inc.

Typical Applications:
Electrical and electronic applications adhesives
Product Description
Certificates(0)
Datasheet

Product Description

Typical Applications:Electrical and electronic applications | adhesives

Certificates

No Data...

Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
Shore hardnessShoreD83
Relative permittivity1kHz4.23
Volume resistivity23°C>3.0E+13ohms·cm
Dissipation factor1kHz3E-03
LapShearStrength23°C3.49MPa
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
Curing time150°C1.0hr
storage stability29000min
ColorGrey.Light
density2.26g/cm³
viscosity23°C30to50Pa·s
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life26wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>100°C
Linear coefficient of thermal expansionMD:--32.2E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--48.6E-05cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数0.80W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Particle size distribution<50.0µm
Ionic typeCl-90ppm
Ionic typeK+17ppm
Ionic typeNa+142ppm
Ionic typeNH4+392ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
DegradationTemperature468°C
operate temperatureThixotropicIndex1.30
weight loss on heating200°C0.080%
weight loss on heating250°C0.14%
weight loss on heating300°C0.24%
Shear Strength23°C46.9MPa
operate temperatureContinuous-55-200°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)6.15GPa
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.