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Epoxy EPO-TEK® EM127 Epoxy Technology Inc.
Typical Applications:
Electrical and electronic applications adhesives light-emitting diodes printed circuit boards
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | Electrical and electronic applications | adhesives | light-emitting diodes | printed circuit boards |
Certificates
No Data...
Technical Data Sheet
| Cured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Volume resistivity | 23°C | <9.0E-4 | ohms·cm | |
| Shore hardness | ShoreD | 85 | ||
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
| Curing time | 160°C | 0.50 | hr | |
| storage stability | 40000 | min | ||
| Color | Silver | |||
| density | 2.73 | g/cm³ | ||
| viscosity | 23°C | 2.5to3.3 | Pa·s | |
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| shelf-life | -40°C | 52 | wk | |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Linear coefficient of thermal expansion | MD：--4 | 1.2E-04 | cm/cm/°C | |
| MD：导热系数 | 1.2 | W/m/K | ||
| Glass transition temperature | >65.0 | °C | ||
| Linear coefficient of thermal expansion | MD：--3 | 2.8E-05 | cm/cm/°C | |
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Particle size distribution | <20.0 | µm | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| Shear Strength | 23°C | 23.4 | MPa | |
| operate temperature | Continuous | -55-200 | °C | |
| Intermittent | -55-300 | °C | ||
| DegradationTemperature | TGA | 380 | °C | |
| operate temperature | StorageModulus(23°C) | 4.67 | GPa | |
| ThixotropicIndex | 5.50 | |||
| weight loss on heating | 200°C | 0.22 | % | |
| 300°C | 0.65 | % |
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