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Epoxy TZ101 Epoxy Technology Inc.
Typical Applications:
Adhesive bonding agents electrical and electronic applications optical applications
Product Description
Certificates(0)
Datasheet
Product Description
| Typical Applications: | Adhesive | bonding agents | electrical and electronic applications | optical applications |
Certificates
No Data...
Technical Data Sheet
| Cured Properties | Test Condition | Test Method | Test Result | Test Unit |
|---|---|---|---|---|
| Dissipation factor | 1kHz | 4E-03 | ||
| Volume resistivity | 23°C | >2.0E+13 | ohms·cm | |
| Relative permittivity | 1kHz | 3.80 | ||
| LapShearStrength | 23°C | 11.9 | MPa | |
| Shore hardness | ShoreD | 84 | ||
| Uncured Properties | Test Condition | Test Method | Test Result | Test Unit |
| storage stability | 40000 | min | ||
| Curing time | 150°C | 1.0 | hr | |
| viscosity | 23°C | 24to30 | Pa·s | |
| density | 1.37 | g/cm³ | ||
| Color | White | |||
| thermosetting | Test Condition | Test Method | Test Result | Test Unit |
| shelf-life | -40°C | 52 | wk | |
| thermal performance | Test Condition | Test Method | Test Result | Test Unit |
| Glass transition temperature | >40.0 | °C | ||
| Linear coefficient of thermal expansion | MD：--3 | 3.2E-05 | cm/cm/°C | |
| MD：导热系数 | 0.93 | W/m/K | ||
| MD：--4 | 1.7E-04 | cm/cm/°C | ||
| Physical properties | Test Condition | Test Method | Test Result | Test Unit |
| Ionic type | K+ | 8 | ppm | |
| Na+ | 188 | ppm | ||
| NH4+ | 19 | ppm | ||
| Cl- | 240 | ppm | ||
| Particle size distribution | <20.0 | µm | ||
| Supplementary Information | Test Condition | Test Method | Test Result | Test Unit |
| weight loss on heating | 300°C | 1.9 | % | |
| 250°C | 0.90 | % | ||
| 200°C | 0.40 | % | ||
| operate temperature | ThixotropicIndex | 3.70 | ||
| StorageModulus(23°C) | 3.54 | GPa | ||
| Intermittent | -55-275 | °C | ||
| Continuous | -55-175 | °C | ||
| Shear Strength | 23°C | 23.4 | MPa | |
| DegradationTemperature | TGA | 355 | °C |
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