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Epoxy EPO-TEK® H31D Epoxy Technology Inc.

Product Description
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Datasheet

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Technical Data Sheet

Cured PropertiesTest ConditionTest MethodTest ResultTest Unit
LapShearStrength23°C7.94MPa
Volume resistivity23°C<5.0E-4ohms·cm
Shore hardnessShoreD85
Uncured PropertiesTest ConditionTest MethodTest ResultTest Unit
ColorSilver
density2.84g/cm³
viscosity23°C40to70Pa·s
Curing time150°C1.0hr
storage stability130000min
thermosettingTest ConditionTest MethodTest ResultTest Unit
shelf-life-40°C26wk
thermal performanceTest ConditionTest MethodTest ResultTest Unit
Glass transition temperature>110°C
Linear coefficient of thermal expansionMD:--34.2E-05cm/cm/°C
Linear coefficient of thermal expansionMD:--41.8E-04cm/cm/°C
Linear coefficient of thermal expansionMD:导热系数3.5W/m/K
Physical propertiesTest ConditionTest MethodTest ResultTest Unit
Ionic typeK+36ppm
Ionic typeNa+222ppm
Particle size distribution<20.0µm
Ionic typeCl-19ppm
Supplementary InformationTest ConditionTest MethodTest ResultTest Unit
DegradationTemperatureTGA350°C
operate temperatureIntermittent-55-300°C
operate temperatureStorageModulus(23°C)6.25GPa
operate temperatureThixotropicIndex3.90
weight loss on heating200°C0.080%
weight loss on heating250°C0.18%
weight loss on heating300°C0.43%
Shear Strength23°C11.7MPa
operate temperatureContinuous-55-200°C
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.