Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
LCP E6807LHF Z WUXI SUMIKA
--
Household appliances,Spool,Laptop case
Low warpage,Easy to process,Flame retardant,Glass fiber reinforced,Filler: Long glass fiber
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Plastic Datasheets
| Impact resistance | Test Condition | Test Method | WUXI SUMIKA/E6807LHF Z |
|---|---|---|---|
| Suspended wall beam without notch impact strength | 6.40mm | ASTM D256 | 340 J/m |
| Supplementary Information | Test Condition | Test Method | WUXI SUMIKA/E6807LHF Z |
|---|---|---|---|
| Solder resistance | 内部方法 | 295 °C |
| hardness | Test Condition | Test Method | WUXI SUMIKA/E6807LHF Z |
|---|---|---|---|
| Rockwell hardness | R级 | ASTM D785 | 101 |
| Electrical performance | Test Condition | Test Method | WUXI SUMIKA/E6807LHF Z |
|---|---|---|---|
| Dissipation Factor | 1kHz | ASTM D150 | 0.024 |
| Compared to the Leakage Tracking Index (CTI) | IEC 60112 | PLC 4 | |
| Volume resistivity | ASTM D257 | 1E+15 ohms·cm | |
| Dissipation Factor | 1MHz | ASTM D150 | 0.030 |
| dielectric constant | 1kHz | ASTM D150 | 4.70 |
| 1MHz | ASTM D150 | 4.10 | |
| arc resistance | ASTM D495 | 180 sec |
| Mechanical properties | Test Condition | Test Method | WUXI SUMIKA/E6807LHF Z |
|---|---|---|---|
| elongation | 断裂 | ASTM D638 | 4.5 % |
| Flexural modulus | 200°C | ASTM D790 | 4500 Mpa |
| shear strength | ASTM D732 | 53.0 Mpa | |
| tensile strength | 屈服 | ASTM D638 | 134 Mpa |
| bending strength | 屈服,23°C | ASTM D790 | 145 Mpa |
| Poisson's ratio | 7.58 0.41 | ||
| Flexural modulus | 23°C | ASTM D790 | 12100 Mpa |
| bending strength | 屈服,200°C | ASTM D790 | 29.0 Mpa |
| flammability | Test Condition | Test Method | WUXI SUMIKA/E6807LHF Z |
|---|---|---|---|
| Limiting Oxygen Index | ISO 489 | 45 % | |
| UL flame retardant rating | 0.30mm | UL 94 | V-0 |
| physical property | Test Condition | Test Method | WUXI SUMIKA/E6807LHF Z |
|---|---|---|---|
| Shrinkage rate | MD | 内部方法 | 0.11 % |
| Water absorption rate | 饱和 | ASTM D570 | 0.020 % |
| Shrinkage rate | TD | 内部方法 | 0.63 % |
| Thermal performance | Test Condition | Test Method | WUXI SUMIKA/E6807LHF Z |
|---|---|---|---|
| Heat distortion temperature | 1.8MPa,未退火，HDT | ASTM D648 | 270 °C |
| Linear coefficient of thermal expansion | MD:150°C | 内部方法 | 1E-05 cm/cm/°C |
| TD:150°C | 内部方法 | 6.3E-05 cm/cm/°C | |
| thermal conductivity | JISR2618 | 0.56 W/m/K |
Contact Us
Get App
Top