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Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy H67-MP Epoxy Technology Inc.
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Adhesives, electrical, electronic applications, military applications
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Plastic Datasheets

Supplementary InformationTest ConditionTest MethodEpoxy Technology Inc./H67-MP
DegradationTemperature350 °C
operate temperature间歇<300 °C
Shear Strength23°C46.9 MPa
StorageModulus23°C4.43 GPa
weight loss on heating250°C0.71 %
300°C1.2 %
200°C0.48 %
thermal performanceTest ConditionTest MethodEpoxy Technology Inc./H67-MP
Glass transition temperature>90.0 °C
Linear coefficient of thermal expansionMD:导热系数0.50 W/m/K
MD:--31.6E-05 cm/cm/°C
MD:--46.8E-05 cm/cm/°C
Uncured PropertiesTest ConditionTest MethodEpoxy Technology Inc./H67-MP
ColorWhite
Curing time150°C1.0 hr
density2.00 g/cm³
storage stability40000 min
viscosity23°C300to400 Pa·s
thermosettingTest ConditionTest MethodEpoxy Technology Inc./H67-MP
shelf-life-40°C52 wk
Physical propertiesTest ConditionTest MethodEpoxy Technology Inc./H67-MP
Ionic typeNH4+87 ppm
Na+<50 ppm
K+<50 ppm
Cl-<200 ppm
Particle size distribution<20.0 µm
Cured PropertiesTest ConditionTest MethodEpoxy Technology Inc./H67-MP
Dissipation factor1kHz4E-03
LapShearStrength23°C10.5 MPa
Relative permittivity1kHz4.92
Shore hardnessShoreD84
Volume resistivity23°C>6.0E+13 ohms·cm