Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

Epoxy H67-MP Epoxy Technology Inc.
--
Adhesives, electrical, electronic applications, military applications
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Plastic Datasheets
| Supplementary Information | Test Condition | Test Method | Epoxy Technology Inc./H67-MP |
|---|---|---|---|
| DegradationTemperature | 350 °C | ||
| operate temperature | 间歇 | <300 °C | |
| Shear Strength | 23°C | 46.9 MPa | |
| StorageModulus | 23°C | 4.43 GPa | |
| weight loss on heating | 250°C | 0.71 % | |
| 300°C | 1.2 % | ||
| 200°C | 0.48 % |
| thermal performance | Test Condition | Test Method | Epoxy Technology Inc./H67-MP |
|---|---|---|---|
| Glass transition temperature | >90.0 °C | ||
| Linear coefficient of thermal expansion | MD:导热系数 | 0.50 W/m/K | |
| MD:--3 | 1.6E-05 cm/cm/°C | ||
| MD:--4 | 6.8E-05 cm/cm/°C |
| Uncured Properties | Test Condition | Test Method | Epoxy Technology Inc./H67-MP |
|---|---|---|---|
| Color | White | ||
| Curing time | 150°C | 1.0 hr | |
| density | 2.00 g/cm³ | ||
| storage stability | 40000 min | ||
| viscosity | 23°C | 300to400 Pa·s |
| thermosetting | Test Condition | Test Method | Epoxy Technology Inc./H67-MP |
|---|---|---|---|
| shelf-life | -40°C | 52 wk |
| Physical properties | Test Condition | Test Method | Epoxy Technology Inc./H67-MP |
|---|---|---|---|
| Ionic type | NH4+ | 87 ppm | |
| Na+ | <50 ppm | ||
| K+ | <50 ppm | ||
| Cl- | <200 ppm | ||
| Particle size distribution | <20.0 µm |
| Cured Properties | Test Condition | Test Method | Epoxy Technology Inc./H67-MP |
|---|---|---|---|
| Dissipation factor | 1kHz | 4E-03 | |
| LapShearStrength | 23°C | 10.5 MPa | |
| Relative permittivity | 1kHz | 4.92 | |
| Shore hardness | ShoreD | 84 | |
| Volume resistivity | 23°C | >6.0E+13 ohms·cm |