Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

PA66 A3W2G10 BK20560 BASF SHANGHAI
Ultramid®
Laptop case,Industrial machinery,Industrial applications
High mobility,heat-resisting,Filler: Glass fiber reinf,50% filler by weight
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Plastic Datasheets
thermal performance | Test Condition | Test Method | BASF SHANGHAI/A3W2G10 BK20560 |
---|---|---|---|
Hot deformation temperature | 1.8MPa,Unannealed | ISO 75-2/A | 257 °C |
Melting temperature | ISO 3146 | 260 °C |
mechanical properties | Test Condition | Test Method | BASF SHANGHAI/A3W2G10 BK20560 |
---|---|---|---|
Bending modulus | 23°C | ISO 178 | 14900 Mpa |
bending strength | 23°C | ISO 178 | 362 Mpa |
Tensile modulus | 23°C | ISO 527-2 | 17100 Mpa |
Tensile strain | Break,23°C | ISO 527-2 | 2.5 % |
tensile strength | Break,23°C | ISO 527-2 | 234 Mpa |
Physical properties | Test Condition | Test Method | BASF SHANGHAI/A3W2G10 BK20560 |
---|---|---|---|
Water absorption rate | Equilibrium,23°C,50%RH | ISO 62 | 1.2 % |
Saturation,23°C | ISO 62 | 4.0 % |
impact performance | Test Condition | Test Method | BASF SHANGHAI/A3W2G10 BK20560 |
---|---|---|---|
Impact strength of simply supported beam without notch | 23°C | ISO 179 | 88 kJ/m² |