Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

PP FL7015E2 TPC SINGAPORE
COSMOPLENE®
chip
copolymer
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Plastic Datasheets
Other performance | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
---|---|---|---|
rigidity | ASTM D-747 | 1420 Mpa |
Basic Performance | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
---|---|---|---|
density | ASTM D-792 | 0.90 | |
melt mass-flow rate | ASTM D-1238 | 7 g/10min |
film | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
---|---|---|---|
film thickness | 30 µm | ||
Secant modulus | TD | Internal Method | 760 Mpa |
MD | Internal Method | 740 Mpa |
thermal performance | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
---|---|---|---|
Melting temperature | 165 °C |
mechanical properties | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
---|---|---|---|
Bending modulus | ASTM D747 | 1420 Mpa | |
elongation | Yield | ASTM D638 | 800 % |
Break | ASTM D-638 | 800 % | |
tensile strength | Break | ASTM D638 | 44.1 Mpa |
Break | ASTM D-638 | 44.1 Mpa |
Physical properties | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
---|---|---|---|
melt mass-flow rate | ASTM D1238 | 7.0 g/10min |