Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PP FL7015E2 TPC SINGAPORE
COSMOPLENE®
chip
copolymer
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Plastic Datasheets
| Other performance | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
|---|---|---|---|
| rigid | ASTM D-747 | 1420 Mpa |
| film | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
|---|---|---|---|
| Secant modulus | TD | 内部方法 | 760 Mpa |
| film thickness | 30 µm | ||
| Secant modulus | MD | 内部方法 | 740 Mpa |
| Basic performance | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
|---|---|---|---|
| melt mass-flow rate | ASTM D-1238 | 7 g/10min | |
| density | ASTM D-792 | 0.90 g/cm |
| Mechanical properties | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
|---|---|---|---|
| tensile strength | 断裂 | ASTM D-638 | 44.1 Mpa |
| elongation | 断裂 | ASTM D-638 | 800 % |
| 屈服 | ASTM D638 | 800 % | |
| Flexural modulus | ASTM D747 | 1420 Mpa | |
| tensile strength | 断裂 | ASTM D638 | 44.1 Mpa |
| physical property | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
|---|---|---|---|
| melt mass-flow rate | ASTM D1238 | 7.0 g/10min |
| Thermal performance | Test Condition | Test Method | TPC SINGAPORE/FL7015E2 |
|---|---|---|---|
| melting temperature | 165 °C |
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