Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
POM KFX-1006 BK8-114 SABIC INNOVATIVE US
LNP™ THERMOCOMP™
Electronic and electrical components,Laptop case
High temperature resistan,Low temperature resistanc
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Plastic Datasheets
| thermal performance | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1006 BK8-114 |
|---|---|---|---|
| Heat Deflection Temperature | 1.8MPa,未退火,3.20mm，HDT | ASTM D648 | 162 °C |
| mechanical properties | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1006 BK8-114 |
|---|---|---|---|
| elongation | 断裂 | ASTM D638 | 2.8 % |
| tensile strength | 断裂 | ASTM D638 | 148 Mpa |
| bending strength | ASTM D790 | 214 Mpa | |
| flexural modulus | ASTM D790 | 10300 Mpa |
| Physical properties | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1006 BK8-114 |
|---|---|---|---|
| shrinkage rate | MD：24小时 | ASTM D955 | 0.50 % |
| TD：24hr | ASTM D955 | 2.0 % |
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