Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

POM KFX-1006 BK8-114 SABIC INNOVATIVE US
LNP™ THERMOCOMP™
Electronic and electrical components,Laptop case
High temperature resistan,Low temperature resistanc
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Plastic Datasheets
thermal performance | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1006 BK8-114 |
---|---|---|---|
Hot deformation temperature | 1.8MPa,Unannealed,3.20mm | ASTM D648 | 162 °C |
mechanical properties | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1006 BK8-114 |
---|---|---|---|
Bending modulus | ASTM D790 | 10300 Mpa | |
bending strength | ASTM D790 | 214 Mpa | |
elongation | Break | ASTM D638 | 2.8 % |
tensile strength | Break | ASTM D638 | 148 Mpa |
Physical properties | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1006 BK8-114 |
---|---|---|---|
Shrinkage rate | TD:24hr | ASTM D955 | 2.0 % |
MD:24hr | ASTM D955 | 0.50 % |