plas

Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
POM KFX-1006 BK8-114 SABIC INNOVATIVE US
LNP™ THERMOCOMP™ 
Electronic and electrical components,Laptop case
High temperature resistan,Low temperature resistanc
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Plastic Datasheets

thermal performanceTest ConditionTest MethodSABIC INNOVATIVE US/KFX-1006 BK8-114
Hot deformation temperature1.8MPa,Unannealed,3.20mmASTM D648162 °C
mechanical propertiesTest ConditionTest MethodSABIC INNOVATIVE US/KFX-1006 BK8-114
Bending modulusASTM D79010300 Mpa
bending strengthASTM D790214 Mpa
elongationBreakASTM D6382.8 %
tensile strengthBreakASTM D638148 Mpa
Physical propertiesTest ConditionTest MethodSABIC INNOVATIVE US/KFX-1006 BK8-114
Shrinkage rateTD:24hrASTM D9552.0 %
MD:24hrASTM D9550.50 %