Material Comparison
Product Info
Product Name
Brand Name
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Epoxy Devcon Floor Patch Devcon
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Plastic Datasheets
| Supplementary Information | Test Condition | Test Method | Devcon/Devcon Floor Patch |
|---|---|---|---|
| Temperature resistance | Wet | 49 °C | |
| Dry | 121 °C |
| hardness | Test Condition | Test Method | Devcon/Devcon Floor Patch |
|---|---|---|---|
| Shore hardness | 邵氏D | ASTM D2240 | 85 |
| Mechanical properties | Test Condition | Test Method | Devcon/Devcon Floor Patch |
|---|---|---|---|
| compressive strength | ASTM D695 | 55.2 MPa |
| thermosetting | Test Condition | Test Method | Devcon/Devcon Floor Patch |
|---|---|---|---|
| Thermosetting components | 储存稳定性(24°C) | 45 min | |
| 硬化法 | 按重量计算的混合比:1.0 | ||
| 树脂 | 按重量计算的混合比:5.5 |
| Uncured Properties | Test Condition | Test Method | Devcon/Devcon Floor Patch |
|---|---|---|---|
| Curing Time | 24°C | 16 hr |
| physical property | Test Condition | Test Method | Devcon/Devcon Floor Patch |
|---|---|---|---|
| Solid content by volume | 100 % |
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