Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PA66 GW 350 Q500 NA ASCEND USA
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Electrical appliances、Electrical enclosure、switch、Fasteners、Electrical/Electronic App、Spool、Vehicle electronics、Lighting applications、printed circuit board、Laptop case、Movable hinge、Industrial applications、Electrical components
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Plastic Datasheets
physical property
Test Condition
Test Method
Unit
PA66/ASCEND USA/GW 350 Q500 NA
Shrinkage rate
TD:23°C,2.00mm
ISO294-4
%
1
Shrinkage rate
MD:23°C,2.00mm
ISO294-4
%
1
Water absorption rate
平衡,23°C,50%RH
ISO62
%
2
Mechanical performance
Test Condition
Test Method
Unit
PA66/ASCEND USA/GW 350 Q500 NA
tensile strength
断裂,23°C
ISO527-2
Mpa
8
elongation
断裂,23°C
ISO527-2
%
1
Bending modulus
23°C
ISO178
Mpa
3
Thermal performance
Test Condition
Test Method
Unit
PA66/ASCEND USA/GW 350 Q500 NA
Hot deformation temperature
1.8MPa,未退火
ISO75-2/A
°C
6
Melting temperature
ISO11357-3
°C
2
Electrical performance
Test Condition
Test Method
Unit
PA66/ASCEND USA/GW 350 Q500 NA
Dielectric strength
1.00mm
IEC60243
KV/mm
1
Leakage Trace Index
3.00mm
IEC60112
V
2
flammability
Test Condition
Test Method
Unit
PA66/ASCEND USA/GW 350 Q500 NA
Hot filament ignition temperature
0.40mm
IEC60695-2-13
°C
9
Hot filament ignition temperature
0.75mm
IEC60695-2-13
°C
9
Hot filament ignition temperature
1.5mm
IEC60695-2-13
°C
8
Hot filament ignition temperature
3.0mm
IEC60695-2-13
°C
8
Burning wire flammability index
0.40mm
IEC60695-2-12
°C
9
Burning wire flammability index
0.75mm
IEC60695-2-12
°C
9
Burning wire flammability index
1.5mm
IEC60695-2-12
°C
9
Burning wire flammability index
3.0mm
IEC60695-2-12
°C
9
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