plas

Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PC CGH2010KR MITSUBISHI ENGINEERING JAPAN
IUPILON™ 
Electronic and Electrical Applications,Wrapping molding,Cable sheath,Wire and cable applications,pipeline,Soft handle,currency,Washer,Weatherproof sealing strip,Profile,Coating application,packing,Pipe fittings,Phone case,Fabric coating
Filler: Glass fiber reinf,10%,Filler by weight,Carbon fiber reinforced m
TDSUL
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Plastic Datasheets

thermal performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/CGH2010KR
Hot deformation temperature0.45MPa,UnannealedISO 75-2/B148 °C
1.8MPa,UnannealedISO 75-2/A143 °C
Linear coefficient of thermal expansionTDISO 11359-25.3E-05 cm/cm/°C
MDISO 11359-21.1E-05 cm/cm/°C
mechanical propertiesTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/CGH2010KR
Bending modulusISO 17815000 Mpa
bending strengthISO 178210 Mpa
Tensile modulusISO 527-217300 Mpa
Tensile strainBreakISO 527-21.3 %
tensile strengthBreakISO 527-2163 Mpa
Physical propertiesTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/CGH2010KR
melt mass-flow rate300°C/1.2kgISO 11334.3 g/10min
Melt Volume Flow Rate (MVR)300°C/1.2kgISO 11333.50 cm3/10min
Shrinkage rate吸水率(Saturation,23°C)0.090 %
MD:3.20mm0.020-0.15 %
TD:3.20mm0.15-0.35 %
impact performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/CGH2010KR
Impact strength of simply supported beam without notch23°CISO 17940 kJ/m²
flammabilityTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/CGH2010KR
UL flame retardant rating0.40mmUL 94HB