Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PI, TS P1011S Epoxy Technology Inc.
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Plastic Datasheets

Supplementary InformationTest ConditionTest MethodEpoxy Technology Inc./P1011S
DegradationTemperatureTGA379 °C
weight loss on heating250°C0.090 %
Shear Strength23°C9.38 MPa
operate temperatureStorageModulus(23°C)4.41 GPa
weight loss on heating300°C0.16 %
operate temperatureContinuous-55-225 °C
weight loss on heating200°C0.080 %
operate temperatureIntermittent-55-325 °C
ThixotropicIndex1.80
Uncured PropertiesTest ConditionTest MethodEpoxy Technology Inc./P1011S
Curing Time150°C1.0 hr
ColorSilver
Viscosity23°C6.5to11 Pa·s
density2.43 g/cm³
Curing Time80°C6<0.50 hr
thermosettingTest ConditionTest MethodEpoxy Technology Inc./P1011S
shelf-life23°C52 wk
Post curing time285°C1.5 hr
drying time7.0 day
Cured PropertiesTest ConditionTest MethodEpoxy Technology Inc./P1011S
Volume resistivity23°C<5.0E-4 ohms·cm
Shore hardnessShoreD71
physical property Test ConditionTest MethodEpoxy Technology Inc./P1011S
Particle size<20.0 µm
Thermal performanceTest ConditionTest MethodEpoxy Technology Inc./P1011S
Glass Transition Temperature>100 °C
Linear coefficient of thermal expansionMD:--32.8E-05 cm/cm/°C
MD:--45.7E-05 cm/cm/°C
MD:导热系数>2.8 W/m/K

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