Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

PI, TS P1011S Epoxy Technology Inc.
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Plastic Datasheets
Supplementary Information | Test Condition | Test Method | Epoxy Technology Inc./P1011S |
---|---|---|---|
DegradationTemperature | TGA | 379 °C | |
weight loss on heating | 250°C | 0.090 % | |
Shear Strength | 23°C | 9.38 MPa | |
operate temperature | StorageModulus(23°C) | 4.41 GPa | |
weight loss on heating | 300°C | 0.16 % | |
operate temperature | Continuous | -55-225 °C | |
weight loss on heating | 200°C | 0.080 % | |
operate temperature | Intermittent | -55-325 °C | |
ThixotropicIndex | 1.80 |
Uncured Properties | Test Condition | Test Method | Epoxy Technology Inc./P1011S |
---|---|---|---|
Curing Time | 150°C | 1.0 hr | |
Color | Silver | ||
Viscosity | 23°C | 6.5to11 Pa·s | |
density | 2.43 g/cm³ | ||
Curing Time | 80°C6 | <0.50 hr |
thermosetting | Test Condition | Test Method | Epoxy Technology Inc./P1011S |
---|---|---|---|
shelf-life | 23°C | 52 wk | |
Post curing time | 285°C | 1.5 hr | |
drying time | 7.0 day |
Cured Properties | Test Condition | Test Method | Epoxy Technology Inc./P1011S |
---|---|---|---|
Volume resistivity | 23°C | <5.0E-4 ohms·cm | |
Shore hardness | ShoreD | 71 |
physical property | Test Condition | Test Method | Epoxy Technology Inc./P1011S |
---|---|---|---|
Particle size | <20.0 µm |
Thermal performance | Test Condition | Test Method | Epoxy Technology Inc./P1011S |
---|---|---|---|
Glass Transition Temperature | >100 °C | ||
Linear coefficient of thermal expansion | MD:--3 | 2.8E-05 cm/cm/°C | |
MD:--4 | 5.7E-05 cm/cm/°C | ||
MD:导热系数 | >2.8 W/m/K |
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