Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

PARA 1032 MITSUBISHI ENGINEERING JAPAN
RENY™
Electronic and Electrical Applications
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Plastic Datasheets
| thermal performance | Test Condition | Test Method | MITSUBISHI ENGINEERING JAPAN/1032 |
|---|---|---|---|
| Hot deformation temperature | HDT | ASTM D648 | 226 °C |
| UL flame retardant rating | UL 94 | HB |
| mechanical properties | Test Condition | Test Method | MITSUBISHI ENGINEERING JAPAN/1032 |
|---|---|---|---|
| Bending modulus | ASTM D790 | 20.9 GPa | |
| bending strength | ASTM D790 | 377 | |
| compressive strength | ASTM D695 | 227 Mpa | |
| Rockwell hardness | ASTM D785 | 108 M | |
| tensile strength | ASTM D638 | 275 Mpa |
| Electrical performance | Test Condition | Test Method | MITSUBISHI ENGINEERING JAPAN/1032 |
|---|---|---|---|
| Dielectric constant | ASTM D150 | 38 Pf/m | |
| Dielectric loss | Tangent | ASTM D150 | 0.008 |
| Dielectric strength | ASTM D149 | 23.7 MV/m |
| Physical properties | Test Condition | Test Method | MITSUBISHI ENGINEERING JAPAN/1032 |
|---|---|---|---|
| Filling amount | 60 % | ||
| Shrinkage rate | ASTM D955 | 0.38 % | |
| Water absorption rate | ASTM D570 | 0.11 % |