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Product Name / Manufacturer / Model
Grade
Reference Price
| thermal performance | Test Condition | Test Method | SUMITOMO JAPAN/E5006L |
|---|---|---|---|
| Hot deformation temperature | HDT | ASTM D648/ISO 75 | 355 ℃(℉) |
| other | Test Condition | Test Method | SUMITOMO JAPAN/E5006L |
| purpose | 电气电子应用领域 光学数据存储 线圈骨架 | ||
| characteristic | 低粘度 耐化学性良好 耐热性高 刚性高 耐磨损性良好 | ||
| mechanical properties | Test Condition | Test Method | SUMITOMO JAPAN/E5006L |
| Elongation at Break | ASTM D638/ISO 527 | 4.5 % | |
| Bending modulus | ASTM D790/ISO 178 | 14200 kg/cm²(MPa)[Lb/in²] | |
| bending strength | ASTM D790/ISO 178 | 152 kg/cm²(MPa)[Lb/in²] | |
| Physical properties | Test Condition | Test Method | SUMITOMO JAPAN/E5006L |
| density | ASTM D792/ISO 1183 | 1.60 |
