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Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy II Devcon
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Plastic Datasheets

Supplementary InformationTest ConditionTest MethodDevcon/II
Tensile shear adhesionGBSASTM D100220.7 MPa
ABSASTM D10028.96 MPa
hardnessTest ConditionTest MethodDevcon/II
Shore hardnessShoreDASTM D224075
thermal performanceTest ConditionTest MethodDevcon/II
Usage temperature-55-121 °C
mechanical propertiesTest ConditionTest MethodDevcon/II
elongationBreak5.0to15 %
Uncured PropertiesTest ConditionTest MethodDevcon/II
Curing time24 hr
thermosettingTest ConditionTest MethodDevcon/II
Thermosetting componentsPartA按容量计算的混合比:1.0按重量计算的混合比:1.0
PartB按容量计算的混合比:1.0按重量计算的混合比:1.0
热固性混合粘度56000 cP
WorkTime(22°C)15.0to20.0 min
Physical propertiesTest ConditionTest MethodDevcon/II
density0.998 g/cm³
Solid content by volume100 %
Specific volume1.00 cm³/g
impact performanceTest ConditionTest MethodDevcon/II
impact strength35.7 kJ/m²