Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
POM KFX-1003 SABIC INNOVATIVE US
LNP™ THERMOCOMP™
Electronic and electrical components,Laptop case
High temperature resistan,Low temperature resistanc,Filler: Glass fiber reinf,10% filler by weight
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Plastic Datasheets
| Impact resistance | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1003 |
|---|---|---|---|
| Suspended wall beam without notch impact strength | 23°C | ISO 180/1U | 33 kJ/m² |
| Multi axis Instrumented Impact Energy | ISO 6603-2 | 1.45 J | |
| Impact strength of cantilever beam gap | 23°C | ISO 180/1A | 5.3 kJ/m² |
| thermal performance | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1003 |
|---|---|---|---|
| Heat Deflection Temperature | 1.8MPa,未退火,64.0mm跨距，HDT | ISO 75-2/Af | 161 °C |
| 0.45MPa,未退火,3.20mm，HDT | ASTM D648 | 164 °C | |
| 1.8MPa,未退火,3.20mm，HDT | ASTM D648 | 162 °C |
| mechanical properties | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1003 |
|---|---|---|---|
| Tensile modulus | ISO 527-2/1 | 5400 Mpa | |
| ASTM D638 | 4760 Mpa | ||
| elongation | 断裂 | ASTM D638 | 3.2 % |
| tensile strength | 断裂 | ASTM D638 | 84.5 Mpa |
| 断裂 | ISO 527-2 | 86.4 Mpa | |
| Tensile strain | 断裂 | ISO 527-2 | 3.4 % |
| bending strength | ASTM D790 | 129 Mpa | |
| ISO 178 | 137 Mpa | ||
| flexural modulus | ISO 178 | 5400 Mpa | |
| ASTM D790 | 4620 Mpa |
| Physical properties | Test Condition | Test Method | SABIC INNOVATIVE US/KFX-1003 |
|---|---|---|---|
| shrinkage rate | MD:24小时 | ISO 294-4 | 1.2 % |
| Water absorption rate | 24hr,50%RH | ASTM D570 | 0.19 % |
| shrinkage rate | MD：24小时 | ASTM D955 | 1.2 % |
| TD：24hr | ASTM D955 | 1.3 % | |
| TD:24小时 | ISO 294-4 | 1.3 % | |
| Water absorption rate | 平衡,23°C,50%RH | ISO 62 | 0.35 % |
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