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AES+PC KumhoSunny PC/AES HEC0255B Shanghai KumhoSunny Plastics Co., Ltd.
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Plastic Datasheets
Test Condition | Test Method | Shanghai KumhoSunny Plastics Co., Ltd./KumhoSunny PC/AES HEC0255B | |
---|---|---|---|
tensile strength | ASTM D638 | 55.0 MPa | |
density | ASTM D792 | 1.11 g/cm³ | |
Impact strength of cantilever beam gap | 3.20mm | ASTM D256 | 600 J/m |
elongation | 断裂 | ASTM D638 | 80 % |
Flexural modulus | ASTM D790 | 2100 MPa | |
Shrinkage rate | MD | ASTM D955 | 0.40to0.60 % |
Heat distortion temperature | 1.8MPa,未退火,HDT | ASTM D648 | 106 °C |
melt mass-flow rate | 230°C/10.0kg | ASTM D1238 | 12 g/10min |
bending strength | ASTM D790 | 75.0 MPa |
physical property | Test Condition | Test Method | Shanghai KumhoSunny Plastics Co., Ltd./KumhoSunny PC/AES HEC0255B |
---|---|---|---|
Surface Resistivity | IEC 60093 | >1.0E+15 ohms | |
Volume resistivity | IEC 60093 | >1.0E+15 ohms·cm |
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