Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

LCP E6808THF-B SUMITOMO JAPAN
SUMIKASUPER®
Laptop case、Spool
Glass fiber reinforced、Filler: Long glass fiber、Low warpage、40% filler by weight
UL
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Plastic Datasheets
Impact resistance | Test Condition | Test Method | SUMITOMO JAPAN/E6808THF-B |
---|---|---|---|
Suspended wall beam without notch impact strength | 6.40mm | ASTM D256 | 270 J/m |
hardness | Test Condition | Test Method | SUMITOMO JAPAN/E6808THF-B |
---|---|---|---|
Rockwell hardness | R级 | ASTM D785 | 97 |
Supplementary Information | Test Condition | Test Method | SUMITOMO JAPAN/E6808THF-B |
---|---|---|---|
Solder resistance | 内部方法 | 280 °C |
Mechanical properties | Test Condition | Test Method | SUMITOMO JAPAN/E6808THF-B |
---|---|---|---|
elongation | 断裂 | ASTM D638 | 4.5 % |
shear strength | ASTM D732 | 54.0 Mpa | |
tensile strength | 屈服 | ASTM D638 | 130 Mpa |
bending strength | 屈服,23°C | ASTM D790 | 140 Mpa |
Flexural modulus | 23°C | ASTM D790 | 12500 Mpa |
Electrical performance | Test Condition | Test Method | SUMITOMO JAPAN/E6808THF-B |
---|---|---|---|
dielectric constant | 1.00GHz | ASTM D150 | 3.60 |
Compared to the Leakage Tracking Index (CTI) | IEC 60112 | PLC 3 | |
Volume resistivity | ASTM D257 | 1E+15 ohms·cm | |
Dissipation Factor | 1MHz | ASTM D150 | 0.038 |
dielectric constant | 1MHz | ASTM D150 | 3.80 |
Dissipation Factor | 1.00GHz | ASTM D150 | 4E-03 |
arc resistance | ASTM D495 | 140 sec |
flammability | Test Condition | Test Method | SUMITOMO JAPAN/E6808THF-B |
---|---|---|---|
Limiting Oxygen Index | ISO 489 | 44 % | |
UL flame retardant rating | 0.30mm | UL 94 | V-0 |
physical property | Test Condition | Test Method | SUMITOMO JAPAN/E6808THF-B |
---|---|---|---|
Shrinkage rate | MD | 内部方法 | 0.17 % |
Water absorption rate | 饱和 | ASTM D570 | 0.020 % |
Shrinkage rate | TD | 内部方法 | 0.40 % |
Thermal performance | Test Condition | Test Method | SUMITOMO JAPAN/E6808THF-B |
---|---|---|---|
Heat distortion temperature | 1.8MPa,未退火,HDT | ASTM D648 | 270 °C |
Linear coefficient of thermal expansion | MD:150°C | 内部方法 | 4E-06 cm/cm/°C |
TD:150°C | 内部方法 | 8.1E-05 cm/cm/°C |
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