Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

PC/ABS LAY100F LUCK ENPLA KOREA
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Electrical enclosure,Computer components,Electronic field,Electrical field,Electrical enclosure,Computer components,Electrical/Electronic Applications
Flame retardant,Halogen-free,High mobility
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Plastic Datasheets
| thermal performance | Test Condition | Test Method | LUCK ENPLA KOREA/LAY100F |
|---|---|---|---|
| Hot deformation temperature | 1.8MPa,Unannealed | ASTM D648 | 92.0 °C |
| mechanical properties | Test Condition | Test Method | LUCK ENPLA KOREA/LAY100F |
|---|---|---|---|
| Bending modulus | ASTM D790 | 2350 Mpa | |
| bending strength | ASTM D790 | 83.4 Mpa | |
| tensile strength | ASTM D638 | 54.9 Mpa |
| Physical properties | Test Condition | Test Method | LUCK ENPLA KOREA/LAY100F |
|---|---|---|---|
| Shrinkage rate | MD | ASTM D955 | 0.40-0.60 % |
| impact performance | Test Condition | Test Method | LUCK ENPLA KOREA/LAY100F |
|---|---|---|---|
| Suspended wall beam without notch impact strength | 3.18mm | ASTM D256 | 490 J/m |
| flammability | Test Condition | Test Method | LUCK ENPLA KOREA/LAY100F |
|---|---|---|---|
| UL flame retardant rating | 3.0mm | UL 94 | V-0 |
| 1.5mm | UL 94 | V-0 |