plas

Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PC/PET MB5002R MITSUBISHI ENGINEERING JAPAN
IUPILON™ 
Electronic and Electrical Applications
Antistatic
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Plastic Datasheets

thermal performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/MB5002R
Hot deformation temperature0.45MPa,UnannealedISO 75-2/B132 °C
1.8MPa,UnannealedISO 75-2/A112 °C
Linear coefficient of thermal expansionTDISO 11359-29.6E-05 cm/cm/°C
MDISO 11359-28E-05 cm/cm/°C
mechanical propertiesTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/MB5002R
Bending modulusISO 1782000 Mpa
bending strengthISO 17878.0 Mpa
Nominal tensile fracture strainISO 527-2140 %
Tensile modulusISO 527-22100 Mpa
Tensile strainYieldISO 527-25.9 %
tensile strengthYieldISO 527-250.0 Mpa
Electrical performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/MB5002R
Dielectric strength2.00mmIEC 60243-124 KV/mm
3.00mmIEC 60243-118 KV/mm
Dissipation factor1MHzIEC 602500.023
100HzIEC 602508.1E-03
Relative permittivity100HzIEC 602504.40
1MHzIEC 602503.50
Surface resistivityIEC 600937E+11 ohms
Volume resistivityIEC 600933E+13 ohms·cm
Physical propertiesTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/MB5002R
melt mass-flow rate300°C/1.2kgISO 113310 g/10min
Melt Volume Flow Rate (MVR)300°C/1.2kgISO 11339.20 cm3/10min
Shrinkage rateMD:3.20mm0.60-0.80 %
TD:3.20mm0.60-0.80 %
Water absorption rateSaturation,23°CISO 620.20 %
impact performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/MB5002R
Impact strength of simply supported beam without notch23°CISO 179NoBreak