Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

PA6 H8202NLB HONEYWELL USA
Aegis®
Electronic field,Electrical field
filling,Good forming performance
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Plastic Datasheets
thermal performance | Test Condition | Test Method | HONEYWELL USA/H8202NLB |
---|---|---|---|
Hot deformation temperature | 0.45MPa,dry | ASTM D-648 | 178 °C |
1.80MPa,dry | ASTM D-648 | 65 °C | |
Linear coefficient of thermal expansion | Dry | ASTM E-831 | 0.83×10 |
Melting temperature | Dry | ASTM D-3418 | 220 °C |
mechanical properties | Test Condition | Test Method | HONEYWELL USA/H8202NLB |
---|---|---|---|
Bending modulus | 23℃,dry | ASTM D-790 | 2830 |
bending strength | 23℃,dry | ASTM D-790 | 110 |
Elongation at Break | 23℃,dry | ASTM D-638 | 55 |
Impact strength of cantilever beam gap | 23℃,dry | ASTM D-256 | 60 |
Rockwell hardness | Dry | 119 R scale | |
tensile strength | 23℃,Dry,Yield | ASTM D-638 | 79 |
23℃,dry,Break | ASTM D-638 | 75 |
Electrical performance | Test Condition | Test Method | HONEYWELL USA/H8202NLB |
---|---|---|---|
Dielectric strength | 1.5mm,dry | ASTM D-149 | 22 |
Volume resistivity | ASTM D-257 | >10 |
Physical properties | Test Condition | Test Method | HONEYWELL USA/H8202NLB |
---|---|---|---|
humidity | (24hr) | ASTM D570 | 1.6 % |
Saturation | ASTM D570 | 9.5 % | |
50%湿度 | ASTM D570 | 2.7 % | |
Shrinkage rate | 1/8",Dry | 0.012 |