Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy Plaskon NXG-1FP Cookson Electronics - Semiconductor Products
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Plastic Datasheets
| Mechanical properties | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon NXG-1FP |
|---|---|---|---|
| Flexural modulus | 260°C | ASTM D790 | 0.0686 MPa |
| bending strength | 22°C | ASTM D790 | 0.0126 MPa |
| 260°C | ASTM D790 | 8.63E-04 MPa | |
| Flexural modulus | 22°C | ASTM D790 | 2.26 MPa |
| flammability | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon NXG-1FP |
|---|---|---|---|
| UL flame retardant rating | 3.2mm | UL 94 | V-0 |
| physical property | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon NXG-1FP |
|---|---|---|---|
| density | ASTM D792 | 1.97 g/cm³ |
| Thermal performance | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon NXG-1FP |
|---|---|---|---|
| thermal conductivity | ASTMC177 | 0.70 W/m/K | |
| Linear coefficient of thermal expansion | MD | ASTM D696 | 1.2E-05 cm/cm/°C |
| Glass Transition Temperature | ASTME1356 | 150 °C |
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