Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

PSU R-5100 WH387 SOLVAY USA
UDEL®
Aerospace,Dental application field,Wire sheath,Laptop case,Medical devices,battery
enhance,dimensional stability ,Thermal stability,Hydrolysis resistance,Flame retardant
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Plastic Datasheets
| film | Test Condition | Test Method | SOLVAY USA/R-5100 WH387 |
|---|---|---|---|
| Area coefficient | 149 ft²/lb/mil | ||
| Dart impact | ASTM D1709B | 750 g | |
| elongation | MD:Yield | ASTM D882 | 9.2 % |
| TD:Yield | ASTM D882 | 6.8 % | |
| MD:Break | ASTM D882 | 140 % | |
| TD:Break | ASTM D882 | 100 % | |
| film thickness | -- | 25 µm | |
| --2 | 50 µm | ||
| --3 | 130 µm | ||
| Secant modulus | MD | ASTM D882 | 1590 Mpa |
| TD | ASTM D882 | 1980 Mpa | |
| tear strength | ASTM D1922 | 140 gf | |
| tensile strength | TD:Break | ASTM D882 | 70.0 Mpa |
| MD:Break | ASTM D882 | 92.0 Mpa | |
| MD:Yield | ASTM D882 | 68.0 Mpa | |
| TD:Yield | ASTM D882 | 59.0 Mpa |
| thermal performance | Test Condition | Test Method | SOLVAY USA/R-5100 WH387 |
|---|---|---|---|
| Glass transition temperature | ASTME1356 | 220 °C | |
| Hot deformation temperature | 1.8MPa,Unannealed,3.18mm | ASTM D648 | 207 °C |
| Linear coefficient of thermal expansion | MD:3.18mm | ASTM D696 | 5.6E-05 cm/cm/°C |
| mechanical properties | Test Condition | Test Method | SOLVAY USA/R-5100 WH387 |
|---|---|---|---|
| tear strength | Kg/m | 8.1 |
| Electrical performance | Test Condition | Test Method | SOLVAY USA/R-5100 WH387 |
|---|---|---|---|
| Dielectric constant | ASTM D150 | 3.45 | |
| Dielectric strength | 0.0250mm | ASTM D149 | 190 KV/mm |
| Volume resistivity | ASTM D257 | 9E+15 ohms·cm |
| Physical properties | Test Condition | Test Method | SOLVAY USA/R-5100 WH387 |
|---|---|---|---|
| Water absorption rate | 24hr | ASTM D570 | 0.37 % |
| flammability | Test Condition | Test Method | SOLVAY USA/R-5100 WH387 |
|---|---|---|---|
| Extreme Oxygen Index | ASTM D2863 | 38 % |