Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy T7110 Epoxy Technology Inc.
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Plastic Datasheets
| Supplementary Information | Test Condition | Test Method | Epoxy Technology Inc./T7110 |
|---|---|---|---|
| DegradationTemperature | TGA | 314 °C | |
| weight loss on heating | 250°C | 0.66 % | |
| Shear Strength | 23°C | 23.4 MPa | |
| operate temperature | StorageModulus(23°C) | 5.44 GPa | |
| Continuous | -55-150 °C | ||
| weight loss on heating | 300°C | 1.8 % | |
| operate temperature | Intermittent | -55-250 °C | |
| ThixotropicIndex | 2.20 | ||
| weight loss on heating | 200°C | 0.40 % |
| Uncured Properties | Test Condition | Test Method | Epoxy Technology Inc./T7110 |
|---|---|---|---|
| density | 粘度7(23°C) | 1.4to2.2 Pa·s | |
| PartA | 2.27 g/cm³ | ||
| Color | --6 | Grey | |
| density | 固化时间(80°C) | >2.0 hr | |
| Color | --5 | Clear/Transparent | |
| density | 储存稳定性 | 210 min | |
| PartB | 0.918 g/cm³ |
| thermosetting | Test Condition | Test Method | Epoxy Technology Inc./T7110 |
|---|---|---|---|
| Thermosetting components | 部件A | 按重量计算的混合比:10 | |
| 贮藏期限(23°C) | 52 wk | ||
| 部件B | 按重量计算的混合比:1.0 |
| Cured Properties | Test Condition | Test Method | Epoxy Technology Inc./T7110 |
|---|---|---|---|
| Volume resistivity | 23°C | >2.0E+13 ohms·cm | |
| Dissipation Factor | 1kHz | 9E-03 | |
| relative permittivity | 1kHz | 5.69 | |
| LapShearStrength | 23°C | >13.3 MPa | |
| Shore hardness | ShoreD | 91 |
| physical property | Test Condition | Test Method | Epoxy Technology Inc./T7110 |
|---|---|---|---|
| Particle size | <50.0 µm |
| Thermal performance | Test Condition | Test Method | Epoxy Technology Inc./T7110 |
|---|---|---|---|
| Glass Transition Temperature | >40.0 °C | ||
| Linear coefficient of thermal expansion | MD：--3 | 3.1E-05 cm/cm/°C | |
| MD：--4 | 1.4E-04 cm/cm/°C | ||
| MD：导热系数 | 1.0 W/m/K |
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